Title of article
Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part II: Reliability experiment and numerical simulation
Author/Authors
Shi Xunqing، نويسنده , , John HL Pang، نويسنده , , Yang Qianjin، نويسنده , , Wang Zhiping، نويسنده , , Nie Jingxu ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2002
Pages
12
From page
356
To page
367
Keywords
acceleration factor , long-term reliability , plastic BGA assembly , FE numerical simulation , MDS reliability experiment
Journal title
Acta Mechanica Sinica
Serial Year
2002
Journal title
Acta Mechanica Sinica
Record number
360333
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