Title of article
Quality investigation of joint of bipolar transistor chip and lead frame by thermal wave method
Author/Authors
Suszynski، نويسنده , , Z.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1997
Pages
3
From page
78
To page
80
Journal title
I E T Circuits, Devices and Systems
Serial Year
1997
Journal title
I E T Circuits, Devices and Systems
Record number
371158
Link To Document