This paper reports the development of embedded droplet impingement for integrated cooling of electronics (EDIFICE). The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes in the range 70–100 W/c

Nucleate boiling heat transfer has been investigated from a horizontal copper tube (4.35 mm O.D.) to mixtures of water/1-butanol and to the pure components at saturation temperatures between 100 °C and 150 °C and at compositions within and beyond the miscibility gap of this binary system. Simultaneously, the vapour–liquid or vapour–liquid–liquid equilibrium has been investigated. The results of the heat transfer measurements do not exhibit any peculiarities due to partial miscibility.