Title of article
Cell Phone Integration: SiP, SoC, and PoP
Author/Authors
Peter Rickert، نويسنده , , Texas Instruments William Krenik، نويسنده , , Texas Instruments ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
8
From page
188
To page
195
Abstract
Engineers must make many cost-effective decisions during a productʹs design cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, and package-on-package integration for mobile phone applications
Journal title
IEEE Design and Test of Computers
Serial Year
2006
Journal title
IEEE Design and Test of Computers
Record number
431662
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