Title of article
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array
Author/Authors
Dong Gun Kam، نويسنده , , Korea Advanced Institute of Science and Technology Joungho Kim، نويسنده , , Korea Advanced Institute of Science and Technology Jiheon Yu، نويسنده , , Amkor Technology Korea Ho Choi، نويسنده , , Amkor Technology Korea Kicheol Bae، نويسنده , , Amkor Technology Korea Choonheung Lee، نويسنده , , Amkor Technology Korea ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
8
From page
212
To page
219
Abstract
System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation. This article addresses problems with wire bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities
Journal title
IEEE Design and Test of Computers
Serial Year
2006
Journal title
IEEE Design and Test of Computers
Record number
431665
Link To Document