Title of article
A numerical study on interface crack growth under heat flux loading
Author/Authors
Ashwin Hattiangadi ، نويسنده , , Thomas Siegmund، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
21
From page
6335
To page
6355
Abstract
A numerical framework for the coupled thermo-mechanical analysis of crack growth in structures loaded by an
applied heat flux is outlined. Using a thermo-mechanical cohesive zone model (TM-CZM), load transfer behavior is
coupled to heat conduction across an interface and the corresponding interface crack. Nonlinear effects occur due to
the coupling between the mechanical and thermal problem introduced by the conductance–separation response between
crack faces as well as through the temperature dependence of material constants of the CZM. The description of the
load transfer behavior uses a traction–separation law with an internal residual property variable that characterizes
the extent of damage caused by mechanical loading. The description of thermal transport includes a representation
of the breakdown of interface conductance with increase in material separation. The current state of interface failure,
the presence of gas entrapped in the crack, the radiative heat transfer across the crack and a contact conductance
between crack faces determine the cohesive zone conductance. The TM-CZM is implemented into a finite element code
and applied in the study of interface crack growth between an oxidation protection coating on a thermal protection
material.
Keywords
Crack growth , Interface , Heat transfer , Cohesive zone
Journal title
International Journal of Solids and Structures
Serial Year
2005
Journal title
International Journal of Solids and Structures
Record number
448348
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