Constitutive and damage model for 63Sn37Pb solder under uniaxial and torsional cyclic loading

A constitutive model with Ohno–Wang kinematic hardening rule is developed and employed to simulate the isothermal cyclic behavior of Sn–Pb solder under uniaxial and torsional loading. An implicit constitutive integration scheme is presented for inelastic flow of solder. Then a modified low cycle fatigue life prediction model is put forward in which the sum of maximum shear strain range and normal strain range based on the critical plane concept is adopted to replace the uniaxial strain range used by Stolkarts et al. [Stolkarts, V., Keer, L.M., Fine, M.E., 1999. Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn–37Pb solder. J. Mech. Phys. Solids 47, 2451–2468]. Comparison of the experimental results and simulation verifies that the stress strain hysteresis loops and peak stress decline curve of solder can be reasonably modeled over a wide range of loading conditions with implement of damage coupled constitutive model, and the lifetime estimations of 63Sn37Pb solder based on the assumption of microcrack nucleation governed damage is effective to provide a conservative prediction.