Title of article
Effects of Residual Stress on Fracture Strength of Si3N4/Stainless Steel Joints With a Cu-interlayer
Author/Authors
Chang، Hwisouck نويسنده , , Park، Sang-Whan نويسنده , , Choi، Sung-Churl نويسنده , , Kirn، Tae-Woo نويسنده ,
Issue Information
دوماهنامه با شماره پیاپی سال 2002
Pages
-63
From page
64
To page
0
Abstract
The variation in fracture strength of a brazed S^N^/Cu/steel joint was compared with the change in residual stress as a function of the Cu-interlayer thickness that was used. The higher residual stress and the lower measured fracture strength for the joint, using a O.I mm thick Cu-interlayer, were ascribed to the entire dissolution of the Cu-interlayer into the brazing alloy. The finite element analysis of residual stress, which considered the microstructure at the interface region, could explain the fracture behavior for the brazed joints, which is dependent on the thickness of the Cu-interlayer.
Keywords
stereochemistry , Triorganylstannyl , (alpha)Carbon , Cycloalkyl Halides , Nitroalkanes , Carbanions , Nitrogen Nucleophiles , Oxygen , Sulfur Nucleophiles , Nitrobenzyl , sp2 Carbons , Cumyl , sp3 Carbons , Heterocyclic Analogues , Radicals Intermediates , Trihalides , Regiochemistry , Alicyclic Aliphatic Substrates , Phosphorus Nucleophiles , Photostimulated Reactions , Geminal Dihalides , Aliphatic Substrates , Carbonylation , EWG , Neopentyl
Journal title
Journal of Materials Engineering and Performance
Serial Year
2002
Journal title
Journal of Materials Engineering and Performance
Record number
60314
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