• Title of article

    Package macromodeling via time-domain vector fitting

  • Author/Authors

    S.، Grivet-Talocia, نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2003
  • Pages
    -471
  • From page
    472
  • To page
    0
  • Abstract
    This paper addresses the construction of lumped macromodels for package structures. A technique named Time-Domain Vector Fitting (TD-VF) is introduced for the identification of the dominant poles of the structure. This method uses as raw data transient excitations and responses at the ports of the structure. These responses are easily obtained from transient fullwave electromagnetic solvers based, e.g., on Finite Differences. The rational approximation can be easily synthesized into a SPICE-compatible subcircuit providing a broadband approximation to the input-output behavior of the package.
  • Keywords
    Power-aware
  • Journal title
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
  • Serial Year
    2003
  • Journal title
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
  • Record number

    66118