Title of article
Primary particle and agglomerate size measurement in chemical mechanical polishing (CMP) slurry using electrospray technique
Author/Authors
Seong-Ho Yoo، نويسنده , , Keung-Shan Woo، نويسنده , , Benjamin Y. H. Liu، نويسنده ,
Issue Information
ماهنامه با شماره پیاپی سال 1998
Pages
2
From page
867
To page
868
Keywords
Electrospray , slurry , primary particle , Size distribution , Chemical mechanical polishing (CMP) , Agglomerate
Journal title
Journal of Aerosol Science
Serial Year
1998
Journal title
Journal of Aerosol Science
Record number
741742
Link To Document