Role of plasticity on interface crack initiation from a free edge and propagation in a nano-component

In order to elucidate the role of plasticity on interface crack initiation from a free edge and crack propagation in a nano-component, delamination experiments were conducted by a proposed nano-cantilever bend method using a specimen consisting of ductile Cu and brittle Si and by a modified four-point bend method. The stress fields along the Cu/Si interface at the critical loads of crack initiation and crack propagation were analyzed by the finite element method. The results reveal that intensified elastic stresses in the vicinity of the interface edge and the crack tip are very different, although the Cu/Si interface is identical in both experiments. The plasticity of Cu was then estimated on the basis of the nano-cantilever deflection measured by in situ transmission electron microscopy. The plasticity affects the stress fields; the normal stress near the interface edge is intensified while that near the crack tip is much reduced. Both the elasto-plastic stresses are close to each other in the region of about 10 nm. This suggests that the local interface fracture, namely, the crack initiation at the interface edge and the crack propagation along the interface, is governed by elasto-plastic normal stress on the order of 10 nm.