Title of article
Tensile behavior and deformation mechanisms of bulk ultrafine-grained copper
Author/Authors
S. J. Xie، نويسنده , , P. K. Liaw، نويسنده , , T. H. Choo، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2006
Pages
5
From page
6328
To page
6332
Abstract
The tensile behaviors of the ultrafinegrained
(UFG) pure copper prepared by cold rolling
have been investigated. The UFG-Cu exhibited high
strengths and low ductility. The ductile dimple-like
fracture surfaces and persistent-slip-bands (PSBs)-like
local shear bands in the tension-deformed UFG-Cu
were observed, both of which typically spanned tens of
grain sizes. This observation indicated that the fracture
mechanisms operated at a larger scale than the grain
size and eventually involved collective grain activities.
Moreover, localized shear bands provided the experimental
evidence to the localized plastic deformation,
which was the one of the dominant reasons, causing the
low ductility in the UFG-Cu
Journal title
Journal of Materials Science
Serial Year
2006
Journal title
Journal of Materials Science
Record number
832100
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