Time-dependent cyclic deformation and failure of 63Sn/37Pb solder alloy

The paper presents an investigation of fatigue characterization of 63Sn/37Pb solder material at varying loading rates and dwell times at room temperature both experimentally and analytically. The cyclic creep (ratchetting) behavior of the eutectic solder is found to be strongly dependent on the stress rate, cyclic mean stress and dwell time. The ratchetting failure of the solder material is therefore highly time-dependent. Based on the experimental results, the time-dependent deformation and damage models are established, and the cyclic failure criteria under different loading conditions were proposed. These models can be used to predict the ratchetting deformation and failure behavior, and the strain rate-dependent low cyclic fatigue life of the solder material. In addition, the effects of dwell time on low cycle fatigue of the materials can also be taken into account.