Chip-level vacuum packaging of micromachines using NanoGetters

A new approach to vacuum packaging of micro-machined resonant, tunneling, and display devices is covered in this paper. A multi-layer, thin-film getter, called a NanoGetter, which is particle free and does not increase the chip size of the microsystem has been developed and integrated into conventional wafer-to-wafer bonding processes. Hermetic electrical feedthroughs are also provided as part of this total-solution technology. Experimental data taken with silicon resonators is presented in which Q values in excess of 21,000 have been obtained. Applications for this technology include gyroscopes, accelerometers, displays, flow sensors, density meters, infrared (IR) sensors, microvacuum tubes, radio frequency microelectromechanical systems (RF-MEMS) and pressure sensors.