Growth Pattern Formation in Copper Electrodeposition: Experiments and Computational Modelling

Experimental results on electrodeposit patterns of copper sulphate solutions in linear cells are presented. Varying the control parameters of the experiment: concentration, cell thickness and voltage between electrodes, many different morphologies are found. A generalized Biased Random Walk computational model in 2D and 3D is introduced for the simulation of the physical experiments that approximately takes into account the control parameters of the physical experiments. The results of the computational model compare well with some of the experimental results.