Improved critical-current-density uniformity by using anodization

We discuss an anodization technique for a Nb superconductive-electronics-fabrication process that results in an improvement in critical-current-density J/sub c/ uniformity across a 150-mm-diameter wafer. We outline the anodization process and describe the metrology techniques used to determine the NbO/sub x/ thickness grown. In the work described, we performed critical current I/sub c/ measurements on Josephson junctions distributed across a wafer. We then compared the J/sub c/ uniformity of pairs of wafers, fabricated together, differing only in the presence or absence of the anodization step. The cross-wafer standard deviation of J/sub c/ was typically ~5% for anodized wafers but >15% for unanodized wafers. This difference in J/sub c/ uniformity is suggestive of an in-process modification from an unknown cause that is blocked by the anodic oxide. It is interesting that small junctions do not see an improvement in I/sub c/ uniformity – apparently the anodization improves only the J/sub c/ uniformity and not the variation in junction size. Control of J/sub c/ is important for all applications of superconductive electronics including quantum computation and rapid single-flux quantum (RSFQ) circuitry.