Laser direct writing of copper on polyimide surfaces from solution

Conductive copper patterns were deposited on polyimide PI. substrates by using a focused, scanned continuous wave cw. Arq laser beam at 488 nm wavelength. The deposition process was initiated by a photothermal reaction of a tartarate-complex solution of Cu2q ions in an alkaline and reducing environment. Deposits were characterised by Field Emission Scanning Electron Microscope FESEM., Energy Dispersive X-ray EDX.Spectrometry, DEKTAK profilometer and resistance measurements. The dependence of the characteristics of laser direct written patterns on the scanning speed of the laser beam, number of scans and laser power was examined. Uniform copper lines covered with copper-oxide line width from 30 to 60 mm and height from 2 to 20 mm. with high conductivity and adhesion were achieved under optimised conditions. q2000 Elsevier Science B.V. All rights reserved.