Electroplating of copper films on steel substrates from acidic gluconate baths

Electroplating of thin films of copper onto steel substrate from acidic gluconate bath has been investigated under different conditions of bath composition, pH, current density, and temperature. A detailed study has been made about the effect of these parameters on potentiodynamic cathodic polarization, cathodic current efficiency CCE%., and throwing power TP.of the bath. Fine grained, highly adherent and smooth bright deposits were produced. X-ray diffraction analysis showed that these deposits were produced in one phase with crystalline cubic structure. The optimum conditions are: 10 g ly1 CuSO4P5H2O, 30 g ly1 C6H11O7Na, 10 g ly1 K2SO4, pHs2.2, Is2.8 mA cmy2, and temperature range between 228C and 318C. The TP of the bath is greatly improved by increasing the current density. q2000 Elsevier Science B.V. All rights reserved.