A multifunctional laser linking and cutting structure for microelectronic circuits

A novel laser-switch has been developed that unites a vertical link structure and a fuse in a vertical arrangement. The structure has been designed and fabricated in a standard three-level metal CMOS process and has been successfully veri®ed. The area of the proposed linking and cutting structure is 20% lower compared to a combination of conventional laser-link and fuse, and the processing time is reduced by up to 50%. The formed laser-links show a very low resistance (Rmedian ˆ 1:7 O). Both linking and cutting structures were processed with 100% yield. # 2000 Elsevier Science B.V. All rights reserved