Nitrogen plasma treatment of the dow Cyclotene 3022 surface and its reaction with evaporated copper

A N2 plasma was used to treat the Cyclotene surface so as to introduce N-containing groups, as determined by both XPS and photoacoustic FTIR. High-resolution XPS has confirmed that at least one such group reacts with the Cu to form strong NCu bonds. These bonds enhance the adhesion of deposited Cu substantially over either untreated or Ar+-treated Cyclotene. As well, they eliminate the surface diffusion of Cu clusters formed on deposition, even at 350°C.