The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering

A study has been made of the effect of relatively high-energy particle (i.e. Ar+, Cu0, Ti0) treatment of the Cyclotene surface on the adhesion of deposited metals. XPS has revealed that all the particles damage the surface in the same manner, limiting the ability of the Cyclotene structure to delocalize electrons. In addition, Cu0 and Ti0 react with the Cyclotene to form new chemical species, the extent of reaction being proportional to the metal reactivity. AFM and TEM reveal that both metals penetrate to substantial depths below the Cyclotene surface, before diffusing out on annealing. Adhesion tests reveal substantial increases in shear adhesion for both Cu and Ti, but an increase in tensile adhesion for Ti alone. This increase in tensile adhesion is shown to be due to the more extensive chemical reactivity of the Ti.