Studies of surface resistance of copper(II) phthalocyanine thin films by using a near-field scanning microwave microscope

We observed the surface resistance of copper(II) phthalocyanine (Cu–Pc) thin films dependence on substrate heating temperature by using a near-field scanning microwave microscope (NSMM). The NSMM system was coupled to a dielectric resonator with a distance regulation system at an operating frequency f ¼ 4:5–5.5 GHz. The crystal structures and surface resistance of Cu–Pc thin films due to different heating temperatures were observed by using X-ray diffraction including the 2y and f-scan and the near-field scanning microwave microscope. As the temperatures increased from room temperature to 200 8C, the crystal structure of Cu–Pc thin films was transformed from monoclinic a-Phase to thermally stable monoclinic b-Phase. The changes in surface resistance of Cu–Pc thin films due to different substrate heating temperatures were investigated by NSMM by measuring the reflection coefficient S11. The surface resistance of Cu–Pc thin films depends on the morphology and crystal alignment of these films. When the substrate temperature for deposition was 150 8C, the minimum surface resistance of Cu–Pc thin films was obtained. # 2004 Elsevier B.V. All rights reserved