DocumentCode
27742
Title
Investigation of Copper Foam Coldplates as a High Heat Flux Electronics Cooling Solution
Author
Fedorov Andrei G. استاد مشاور , Joshi Yogendra استاد راهنما , Graham Samuel استاد مشاور
University
Georgia University Of Technology
Grade
نامعلوم
Major
Master of Science )Mechanical Engineering(
Number of pages
0
Publish Date
2005
Keyword
Thermal management , liquid cooling , single phase convection
Note
01
Language
انگليسي
Link To Document