DocumentCode
4516
Title
Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures
Author
Mark G. Allen استاد راهنما
University
Georgia Institute Of Technology
Grade
دكتري
Major
Doctor of Philosophy
Number of pages
0
Publish Date
2003
Keyword
Microelectromechanical systems , Power amplifiers Measurement , Drugs Design. , Nonlinear functional analysis , electronic packaging
Note
01
Language
انگليسي
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