DocumentCode
4731
Title
In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests
Author
Daniel F. Baldwin استاد راهنما
University
Georgia University Of Technology
Grade
دكتري
Major
Doctor of Philosophy )Mechanical Engineering(
Number of pages
0
Publish Date
2003
Keyword
Flip chip technology Testing , Microelectronic packaging Materials Testing , Semantic networks )Information theory( , Network performance )Telecommunication( , Semiconductors Defects , Antimony Environmental aspects
Note
01
Language
انگليسي
Link To Document