شماره ركورد كنفرانس
5328
عنوان مقاله
Effect of Cu content on structural properties of Ni-Cu @ a-C: H thin films
پديدآورندگان
Goudarzi Samira Department of Physics, Malayer University, Malayer, Iran , Dalouji Vali dalouji@yahoo.com Department of Physics, Malayer University, Malayer, Iran
تعداد صفحه
2
كليدواژه
Ni , Cu thin films , RF , PECVD system , Scanning Electron Microscope (SEM)
سال انتشار
1400
عنوان كنفرانس
بيست و سومين كنفرانس شيمي فيزيك انجمن شيمي ايران
زبان مدرك
انگليسي
چكيده فارسي
In this study, Ni-Cu NPs @ a-C:H films with different Cu percentages, by co- deposition of RF-sputtering and RF- plasma enhanced chemical vapor deposition (RFPECVD) were prepared using acetylene gas and Ni and Cu targets. The EDAX results show that the Ni and Cu are presented in the films successfully. With the increase of Cu percentages, the average diameter of CNTs was increased.
كشور
ايران
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