Thermal Analysis of Sintered Silver Nanoparticles Film

Thermal Analysis of Sintered Silver Nanoparticles Film

Thin bonded films have many applications in coating and semiconductor industries. Thermal conductivity is one of the important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in materials play very important role on the effective thermal conductivity. In this paper, finite element method (FEM) was utilized to simulate the effect of pores on the effective thermal conductivity of sintered silver nanoparticles film. The simulation results indicate that the effective thermal conductivity of film is different at different directions and would be enhanced when the pore angle is 90. The simulation results will help us to further understand the heat transfer process across highly porous structures and will provide us a powerful guide to design coating with high thermal insulation or conductor property.