Photoresist coating methods for the integration of novel 3-D RF microstructures

Author

Pham, Nga Phuong ; Boellaard, E. ; Burghartz, Joachim N. ; Sarro, Pasqualina M.

Author_Institution

Lab. of Electron. Components, Delft Univ. of Technol., Netherlands

Volume

13

Issue

3

fYear

2004

fDate

6/1/2004 12:00:00 AM

Firstpage

491

Lastpage

499

Abstract

This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition (ED) are introduced and investigated for the fabrication of 3-D microstructures and RF-MEMS devices. Characteristics of each method as well as its advantage and disadvantages are outlined. A comparison is made to point out the most suitable coating method in terms of complexity, performance and type of application. The potential of these coating methods is demonstrated through several applications such as fabrication of multilevel micromachined structures and RF MEMS devices.

Keywords

electrodeposition; micromechanical devices; photoresists; spray coating techniques; surface topography; 3D RF microstructures; RF-MEMS devices; electrodeposition; lithography; multilevel micromachined structures; photoresist coating methods; spray coating; topography surfaces; Coatings; Etching; Fabrication; Micromechanical devices; Microstructure; Radio frequency; Radiofrequency microelectromechanical systems; Resists; Spraying; Surface topography; -D structures; ED; Electrodeposition; lithography for MEMS; patterning; photoresist coating; spray coating;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2004.828728

Filename

1303627