Packaging and integration of high-speed optical components

Author

Ray, Curtis

Volume

7

Issue

2

fYear

2004

fDate

6/1/2004 12:00:00 AM

Firstpage

60

Lastpage

62

Abstract

Packaging of high-speed optical components is a complex process involving many interdisciplinary engineering efforts. The design of a packaged component is an interesting combination of optical, mechanical, electrical, and process engineering. This article shows how solving assembly and packaging problems can accelerate the progress in microsystem applications. In this article, automated assembly integrates over 50 specific functions into an array for a low-cost component. The techniques are applicable for other measurement microsystems in different fields of applications for measurement, control, and communications.

Keywords

assembling; high-speed optical techniques; integrated optoelectronics; measurement systems; packaging; assembly problems; component integration; component packaging; electrical engineering; high-speed optical components; measurement microsystems; mechanical engineering; microsystem applications; optical engineering; packaging problems; process engineering; Ceramics; High speed optical techniques; Optical devices; Optical fibers; Optical films; Optical filters; Optical receivers; Optical transmitters; Packaging; Plastics;

fLanguage

English

Journal_Title

Instrumentation & Measurement Magazine, IEEE

Publisher

ieee

ISSN

1094-6969

Type

jour

DOI

10.1109/MIM.2004.1304567

Filename

1304567