DocumentCode
1013877
Title
Failure mechanism models for plastic deformation
Author
Dasgupta, Abhijit ; Hu, Jun Ming
Author_Institution
CALCE Electron. Package Res. Center, Maryland Univ., College Park, MD, USA
Volume
41
Issue
2
fYear
1992
fDate
6/1/1992 12:00:00 AM
Firstpage
168
Lastpage
174
Abstract
A tutorial illustrating designs in which plastic deformation can endanger system performance, thereby acting as an overstress failure mechanism, is presented. Analytic methods, based on continuum mechanics, are presented to design against such failures. Examples illustrate the use of these models in practical designs encountered in mechanical systems and in electronic packaging
Keywords
classical mechanics of continuous media; failure analysis; packaging; plastic deformation; reliability theory; continuum mechanics; electronic packaging; mechanical systems; overstress failure mechanism; plastic deformation; reliability; tutorial; Crystalline materials; Crystallization; Deformable models; Design engineering; Educational institutions; Failure analysis; Lattices; Plastics; Reliability engineering; System performance;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/24.257775
Filename
257775
Link To Document