Improving the reliability of the plastic IC package in reflow soldering process by optimization

Author

Kim, Geun Woo ; Lee, Kang Yong

Author_Institution

Dept. of Mech. Eng., Yonsei Univ., Seoul, South Korea

Volume

27

Issue

2

fYear

2004

fDate

6/1/2004 12:00:00 AM

Firstpage

352

Lastpage

358

Abstract

In order to reduce stress in the plastic small outline J-lead (SOJ) package and prevent the interface delamination under the infrared (IR) soldering process, parameterization, parametric study and optimization are used. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the constraint optimization to the parameterized integrated circuit (IC) package.

Keywords

delamination; integrated circuit packaging; plastic packaging; reflow soldering; reliability; thermal stresses; constraint optimization; infrared soldering; integrated circuit package; interface delamination prevention; material properties; parameterization; parametric study; plastic IC package reliability; reflow soldering; small outline J-lead package; stress reduction; thermal loading; Constraint optimization; Delamination; Integrated circuit packaging; Material properties; Parametric study; Plastic integrated circuit packaging; Plastic packaging; Reflow soldering; Shape; Thermal stresses; Constraint optimization; IC; package; parameterization; parametric study; plastic integrated circuit; thermal loading;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2004.828561

Filename

1308457