DocumentCode
1019962
Title
Toward the Next Level of PCB Usage in Power Electronic Converters
Author
de Jong, E.C.W. ; de Jong, E.C.W. ; Ferreira, B.J.A. ; Bauer, Pavol
Volume
23
Issue
6
fYear
2008
Firstpage
3151
Lastpage
3163
Abstract
A means for power electronics to exploit the level of 3-D packaging already being implemented in compact consumer products, such as digital cameras, is investigated in order to increase its power density. The increase in functionality and usage of printed circuit board (PCB) in power electronic converters is highlighted and improvements proposed to boost PCB usage to the next level. The material and manufacturing cost of an embedded planar transformer in a PCB-assembled power converter has been substantially reduced by introducing flexible-foil PCB to create the many windings without increasing the remaining number of (expensive) rigid PCB layers. Aspects such as the required folding pattern and its PCB material usage receive qualitative and quantitative attention. Furthermore, increasing of PCB functionality as regards integration of passives, geometrical packaging, and 3-D thermal management enhancement has been addressed. Not only is it shown that the integration of passives into a single, multifunctional PCB transformer structure is feasible but also that the same integral PCB can be used to geometrically package the remaining bulky, low-frequency, discrete components to create a power-dense converter and enhance the 3-D thermal management. A power density improvement of 66% (from 150 to 250 W/L) is achieved by the technology demonstrator.
Keywords
power convertors; power integrated circuits; printed circuits; transformers; 3D thermal management enhancement; PCB usage; embedded planar transformer; power electronic converters; printed circuit board; Design methodology; geometrical packaging; optimization methods; packaging; power conversion; power density; power supplies; printed circuit layout; printed circuits;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2008.2004276
Filename
4696042
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