DocumentCode
1020944
Title
CMOS LSI Special Feature: CMOS LSI – Computer Component Process of the 80´s
Author
Wollesen, Donald L.
Author_Institution
American Microsystems, Inc.
Volume
13
Issue
2
fYear
1980
Firstpage
59
Lastpage
67
Abstract
Heat dissipation, or the "thermal barrier," is a problem that circuit designers have faced for years. The answer in the 1980\´s may be CMOS.
Keywords
CMOS process; DRAM chips; Heat treatment; Large scale integration; MOS devices; Power dissipation; Temperature; Very large scale integration;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/MC.1980.1653498
Filename
1653498
Link To Document