DocumentCode
1032404
Title
The laminated overlay transistor, a new approach to high-power-high frequency structures
Author
Becke, H.W.
Volume
15
Issue
6
fYear
1968
fDate
6/1/1968 12:00:00 AM
Firstpage
438
Lastpage
438
Keywords
Boron; Electric breakdown; Electronic packaging thermal management; Etching; Frequency; Insertion loss; Low voltage; Plasma temperature; Power system protection; Thermal resistance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1968.16360
Filename
1475262
Link To Document