DocumentCode

1032902

Title

Internal lead fatigue through thermal expansion in semiconductor devices

Author

Gaffney, J.

Volume

15

Issue

8

fYear

1968

fDate

8/1/1968 12:00:00 AM

Firstpage

617

Lastpage

617

Keywords

Aluminum; Bonding; Fatigue; Heating; Laboratories; Lead compounds; Semiconductor devices; Thermal expansion; Thermal resistance; Wire;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/T-ED.1968.16412

Filename

1475314