DocumentCode
1038001
Title
Designing, packaging, and testing a 300-MHz, 115 W ECL microprocessor
Author
Jouppi, N.P. ; Boyle, P. ; Fitch, J.S.
Author_Institution
Western Res. Lab., Digital Equipment Corp., Palo Alto, CA, USA
Volume
14
Issue
2
fYear
1994
fDate
4/1/1994 12:00:00 AM
Firstpage
50
Lastpage
58
Abstract
A custom microprocessor implemented with 1-μm bipolar technology operates at 300 MHz and dissipates 115 W. By using full-custom ECL technology, we achieved clock rates three to six times faster than 1-μm CMOS processors. We designed this research prototype to develop VLSI ECL circuit techniques, a new style of CAD tools, high-performance chip interfaces, and advanced packaging techniques for high-power microprocessors.
Keywords
bipolar integrated circuits; computer testing; emitter-coupled logic; integrated circuit testing; microprocessor chips; packaging; 115 W; 300 MHz; CAD tools; ECL microprocessor; VLSI; bipolar technology; clock rates; high-performance chip interfaces; high-power microprocessors; packaging; packaging techniques; testing; CMOS process; CMOS technology; Circuit testing; Clocks; Design automation; Microprocessors; Packaging; Process design; Prototypes; Very large scale integration;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/40.272837
Filename
272837
Link To Document