• DocumentCode
    1042137
  • Title

    Failure mechanism models for cyclic fatigue

  • Author

    Dasgupta, Abhijit

  • Author_Institution
    CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA
  • Volume
    42
  • Issue
    4
  • fYear
    1993
  • fDate
    12/1/1993 12:00:00 AM
  • Firstpage
    548
  • Lastpage
    555
  • Abstract
    This work illustrates design situations where mechanical fatigue under cyclic loading, of one or more components, can compromise system performance. In this failure mechanism, damage accumulates with each load cycle, thereby causing a physical wearout failure mechanism. Phenomenological continuum length-scale models, based on micromechanical considerations, are presented to predict the onset (or initiation) of fatigue cracking in ductile materials. Fatigue crack propagation is modeled with continuum fracture mechanics principles. The number of load cycles required to cause failure is predicted based on these models. Approaches for modeling creep fatigue interactions are briefly discussed. Analytic physics-of-failure method and examples are presented for designing against wearout failure due to cyclic fatigue. These models can be implemented in an engineering design environment. The associated stress analysis requires numerical finite element techniques in many cases. The associated material property characterization techniques have matured since the 1950s and are specified in engineering handbooks
  • Keywords
    crack-edge stress field analysis; creep fracture; failure analysis; fatigue cracks; finite element analysis; fracture mechanics; reliability; continuum fracture mechanics; creep fatigue interactions; cyclic fatigue; cyclic loading; damage; ductile materials; engineering design; failure mechanism; fatigue cracking; finite element techniques; mechanical fatigue; micromechanics; modeling; physical wearout; physics-of-failure; stress analysis; Creep; Design engineering; Failure analysis; Fatigue; Finite element methods; Material properties; Micromechanical devices; Predictive models; Stress; System performance;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.273577
  • Filename
    273577