Creep of solder interconnects under combined loads

Author

Lan, J.H.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA

Volume

16

Issue

8

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

794

Lastpage

798

Abstract

An exact analysis is presented for the creep deformation of solder interconnects subjected to the actions of bending moment and axial force. Dimensionless interaction curves and charts which relate the variables, axial force, location of neutral-axis, maximum bending stress and strain rate, bending moment and change in curvature rate are provided for engineering practice convenience. The tangent-modulus buckling loads of centrally loaded solder columns and a simple formula for the critical time to buckling are determined. The constitutive relationship of the solder interconnects is given

Keywords

creep; deformation; soldering; axial force; bending moment; buckling; centrally loaded solder columns; combined loads; creep deformation; critical time; curvature rate; dimensionless interaction curves; engineering practice convenience; exact analysis; maximum bending stress; neutral-axis; solder interconnects creep; strain rate; tangent-modulus buckling loads; Annealing; Capacitive sensors; Creep; Electronics packaging; Materials testing; Mathematical model; Plastics; Steady-state; Stress; Temperature;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.273676

Filename

273676