Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections

Author

Tsuei, Yuh-Sheng ; Cangellaris, Andreas C. ; Prince, John L.

Author_Institution

Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA

Volume

16

Issue

8

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

876

Lastpage

883

Abstract

A methodology is presented for the rigorous electromagnetic analysis of pulse transmission through first-level interconnects. The methodology combines a full-wave, vectorial, time-dependent Maxwell´s equations solver with SPICE circuit models for the nonlinear drivers, to facilitate the accurate modeling of the electromagnetic phenomena occurring at the chip-to-package interface. Comparisons of the results obtained using this method with others calculated using SPICE simulations are used to validate the method and demonstrate its application in the electromagnetic modeling of high-speed packaging structures

Keywords

SPICE; equivalent circuits; finite difference time-domain analysis; lumped parameter networks; modelling; packaging; transmission line theory; EM phenomena; FDTD; SPICE circuit models; chip-to-package interconnections; electromagnetic modeling; first-level interconnections; first-level interconnects; full-wave vectorial time-dependent Maxwell equations solver; high-speed packaging structures; nonlinear drivers; pulse transmission; Bonding; Circuit simulation; Driver circuits; Electromagnetic fields; Electromagnetic modeling; Integrated circuit interconnections; Maxwell equations; Nonlinear equations; SPICE; Solid modeling;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.273688

Filename

273688