• DocumentCode
    1045513
  • Title

    Low-Power Design and Temperature Management

  • Author

    Skadron, Kevin ; Bose, Pradip ; Ghose, Kanad ; Sendag, Resit ; Yi, Joshua J. ; Chiou, Derek

  • Author_Institution
    Virginia Univ., Charlottesville
  • Volume
    27
  • Issue
    6
  • fYear
    2007
  • Firstpage
    46
  • Lastpage
    57
  • Abstract
    One of the primary concerns for microprocessor designers has always been balancing power and thermal management while minimizing performance loss. rather than generate solutions to this dilemma, the advent of multicore chips has raised a host of new challenges. this discussion with Pradip Bose and Kanad Ghose, excerpted from a 2007 Card Workshop Panel, explores the future of low-power design and temperature management.
  • Keywords
    low-power electronics; microprocessor chips; thermal management (packaging); low-power design; microprocessor designer; multicore chip; temperature management; thermal management; Analytical models; Circuits; Energy management; Knowledge management; Microprocessors; Multicore processing; Performance loss; Power dissipation; Temperature control; Thermal management; energy-aware systems; hardware; low-power design; power management; temperature-aware design;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.2007.104
  • Filename
    4437719
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1045513