• DocumentCode
    1047401
  • Title

    Double positive beveling: A better edge contour for high-voltage devices

  • Author

    Cornu, Jozef ; Schweitzer, S. ; Kuhn, O.

  • Author_Institution
    Brown Boveri Research Center, Baden Switzerland
  • Volume
    21
  • Issue
    3
  • fYear
    1974
  • fDate
    3/1/1974 12:00:00 AM
  • Firstpage
    181
  • Lastpage
    184
  • Abstract
    A theoretical analysis is made of the field distribution near the surface of p-n-p structures with double positive edge geometry. This geometry offers in principle the possibility of avoiding the limitations and disadvantages inherent in the use of negative bevel angles. The results show that the reduction of the maximum field at the surface is not as easy as for the case of a simple positive bevel angle and that consequently the passivation of the surface may present more problems. Nevertheless, it is demonstrated that this geometry offers a number of great advantages and presents a real alternative for use in future high-voltage devices. A number of devices, dimensioned for a breakdown voltage of 6 kV, were made with this edge geometry. The measurements show that the reverse current corresponds to the thermally generated current in the space-charge layer and that no significant current flows at the surface. The breakdown voltage corresponds to the theoretical breakdown voltage in the bulk, unlike in the case of double negative beveling. The advantages of this geometry with respect to the conventional negative bevel angle are no significant reduction of active area, no dependence on the doping profile, and no limitation in voltage. A disadvantage, however, is the presence of higher fields at the surface.
  • Keywords
    Charge measurement; Current measurement; Doping profiles; Electron devices; Geometry; Passivation; Poisson equations; Stability; Thyristors; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1974.17893
  • Filename
    1477708