DocumentCode
1048390
Title
Thermal analysis of multiple-layer structures
Author
Kokkas, Achilles G.
Author_Institution
RCA Laboratories, Princeton, N. J.
Volume
21
Issue
11
fYear
1974
fDate
11/1/1974 12:00:00 AM
Firstpage
674
Lastpage
681
Abstract
The response of temperature to dc and steady-state ac power inputs in multiple-layer rectangular structures has been derived by solving analytically the problem of heat flow in three dimensions. Attention is focused on electrothermal integrated circuit (IC) substrates consisting of a semiconductor, a thermal conductor, and a thermal insulator. The analysis applies as well to single-layer systems, such as conventional IC substrates, for which the transient response of temperature has also been found.
Keywords
Circuits; Electrothermal effects; Insulation; Materials science and technology; Mathematical model; Performance analysis; Substrates; Temperature dependence; Thermal conductivity; Thermal management;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1974.17993
Filename
1477808
Link To Document