DocumentCode
1048757
Title
Delay testing of partially depleted silicon-on-insulator (PD-SOI) circuits
Author
MacDonald, Eric ; Touba, Nur A.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Texas at El Paso, TX
Volume
14
Issue
6
fYear
2006
fDate
6/1/2006 12:00:00 AM
Firstpage
587
Lastpage
595
Abstract
Partially depleted silicon-on-insulator (PD-SOI) technology has garnered more attention recently with regards to replacing traditional bulk-silicon technology as the mainstream technology of choice for high-performance/low-power digital applications. The increase in performance is due to the buried oxide layer, which provides a dramatic decrease in the source and drain junction capacitance, as well as a reduction in the traditional back biasing resulting from the body effect. The reported performance increases have been between 20% and 35%. However, this increase in performance comes at a cost of complexity from a performance measurement and delay testing perspective. Where the SOI transistor is faster than the bulk transistor, there exists a variation in delay caused by threshold voltage shifts that must be accounted for during manufacturing test. This paper explores these issues and proposes new test techniques for this promising technology
Keywords
VLSI; integrated circuit testing; silicon-on-insulator; body effect; bulk-silicon technology; buried oxide layer; delay testing; junction capacitance; partially depleted silicon-on-insulator circuits; Capacitance; Circuit testing; Costs; Delay; Dielectric substrates; Energy consumption; Isolation technology; Silicon on insulator technology; Threshold voltage; Very large scale integration; Delay testing; flip-flop design; silicon-on-insulator (SOI) testing;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2006.878209
Filename
1661599
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