• DocumentCode
    104965
  • Title

    Tensile and Bending Strain Tolerance of Ex Situ MgB2/Ni/Cu Superconductor Tape

  • Author

    Kovac, Pavol ; Kopera, Lubomir ; Melisek, Tibor ; Sarmiento, Gustavo ; Sanz Castillo, Santiago ; Brisigotti, Silva ; Nardelli, Davide ; Tropeano, Matteo

  • Author_Institution
    Inst. of Electr. Eng., Bratislava, Slovakia
  • Volume
    25
  • Issue
    2
  • fYear
    2015
  • fDate
    Apr-15
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This paper describes the strain tolerance of MgB2/Ni/Cu tape produced by Columbus Superconductors subjected to tension and bending stress. A tension test instrument with freestanding sample was used for stress-strain, Ic-stress, and Ic-strain characteristics at liquid helium temperature. Bending of MgB2/Ni/Cu tape to variable diameters was done at room temperature and in two directions: 1) with a Cu strip on the outer surface (Cu out) of a bent sample; and 2) with a Cu strip on the inner side (Cu in). Ic-bending strain characteristics were measured at 4.2 K and external field B = 6 T oriented perpendicularly to the sample´s width. Obtained results have shown the strain limits, which should not be exceeded during the winding process of superconductor containing brittle MgB2 filaments.
  • Keywords
    bending; copper; magnesium compounds; nickel; stress-strain relations; superconducting tapes; tensile testing; Columbus superconductors; Cu; MgB2; Ni; bending strain tolerance; bending stress; copper strip; liquid helium temperature; stress-strain characteristic; superconductor tape; tensile tolerance; tension test instrument; winding process; Critical current density (superconductivity); Degradation; Integrated circuits; Nickel; Strain; Stress; Superconducting films; Bending stress; bending stress; critical current degradation; ex situ MgB2 tape; ex-situ MgB2 tape; neutral axis; strain tolerances; tensile stress; the strain tolerances;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2014.2379723
  • Filename
    6994767