• DocumentCode
    1052309
  • Title

    Resonant silicon accelerometers in bulk micromachining technology-an approach

  • Author

    Burrer, Christian ; Esteve, Jaume ; Lora-Tamayo, Emilio

  • Author_Institution
    Centre Nacional de Microelectron., CSIC, Barcelona, Spain
  • Volume
    5
  • Issue
    2
  • fYear
    1996
  • fDate
    6/1/1996 12:00:00 AM
  • Firstpage
    122
  • Lastpage
    130
  • Abstract
    The fabrication and characterization of resonant silicon accelerometers, made in bulk micromachining technology, is presented. The devices consist of a silicon mass, coupled axially to a strain-sensitive vibrating silicon beam. The beam is driven electrothermally and sensed piezoresistively by means of implanted piezoresistors. Two different accelerometer types are shown, differing in the complexity of the respective fabrication processes and in performances. Closed-loop operation of the devices is demonstrated. Also in the closed loop, static and dynamic measurements of prototypes have been performed. The sensor types presented are compared, and the resonant acceleration sensor concept is discussed
  • Keywords
    accelerometers; elemental semiconductors; etching; micromechanical resonators; microsensors; piezoresistive devices; semiconductor technology; silicon; silicon-on-insulator; wafer bonding; BESOI; Si; Si mass; Si resonant accelerometers; bond and etch back SOI; bulk micromachining technology; closed-loop operation; dynamic measurements; implanted piezoresistors; resonant acceleration sensor; static measurements; Accelerometers; Electrothermal effects; Fabrication; Micromachining; Optical coupling; Piezoresistance; Piezoresistive devices; Prototypes; Resonance; Silicon;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.506200
  • Filename
    506200