DocumentCode
1052309
Title
Resonant silicon accelerometers in bulk micromachining technology-an approach
Author
Burrer, Christian ; Esteve, Jaume ; Lora-Tamayo, Emilio
Author_Institution
Centre Nacional de Microelectron., CSIC, Barcelona, Spain
Volume
5
Issue
2
fYear
1996
fDate
6/1/1996 12:00:00 AM
Firstpage
122
Lastpage
130
Abstract
The fabrication and characterization of resonant silicon accelerometers, made in bulk micromachining technology, is presented. The devices consist of a silicon mass, coupled axially to a strain-sensitive vibrating silicon beam. The beam is driven electrothermally and sensed piezoresistively by means of implanted piezoresistors. Two different accelerometer types are shown, differing in the complexity of the respective fabrication processes and in performances. Closed-loop operation of the devices is demonstrated. Also in the closed loop, static and dynamic measurements of prototypes have been performed. The sensor types presented are compared, and the resonant acceleration sensor concept is discussed
Keywords
accelerometers; elemental semiconductors; etching; micromechanical resonators; microsensors; piezoresistive devices; semiconductor technology; silicon; silicon-on-insulator; wafer bonding; BESOI; Si; Si mass; Si resonant accelerometers; bond and etch back SOI; bulk micromachining technology; closed-loop operation; dynamic measurements; implanted piezoresistors; resonant acceleration sensor; static measurements; Accelerometers; Electrothermal effects; Fabrication; Micromachining; Optical coupling; Piezoresistance; Piezoresistive devices; Prototypes; Resonance; Silicon;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/84.506200
Filename
506200
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