DocumentCode
105483
Title
Cycling-Induced SET-Disturb Failure Time Degradation in a Resistive Switching Memory
Author
Yueh-Ting Chung ; Po-Cheng Su ; Yu-Hsuan Cheng ; Tahui Wang ; Min-Cheng Chen ; Chih-Yuan Lu
Author_Institution
Dept. of Electron. EngineeringInstitute of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
36
Issue
2
fYear
2015
fDate
Feb. 2015
Firstpage
135
Lastpage
137
Abstract
A new degradation mode with respect to write-disturb failure time due to SET/RESET cycling in a tungsten oxide resistive random access memory is reported. In a crossbar array memory, we find that a write-disturb failure time in high resistance state reduces suddenly by several orders of magnitude after certain SET/RESET cycles. This abrupt degradation is believed due to the creation of a new soft breakdown path in a switching dielectric by cycling stress. Although a memory window still remains after the degradation, the occurrence probability of over-SET state increases significantly. This cycling-induced degradation mode imposes a serious constraint on the number of SET-disturb pulses and thus an endurance cycle number in a resistive switching memory.
Keywords
electric breakdown; probability; resistive RAM; switching circuits; tungsten compounds; SET-RESET cycling stress; WOx; crossbar array memory; cycling-induced SET-disturb failure time degradation mode; over-SET state probability; resistive switching memory; switching dielectric; tungsten oxide resistive random access memory; write-disturb failure time; Arrays; Current measurement; Degradation; Dielectrics; Electric breakdown; Resistance; Switches; RRAM; SET-disturb; degradation; over-SET;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2014.2385072
Filename
6994811
Link To Document