DocumentCode
1058102
Title
Flexible Dome and Bump Shape Piezoelectric Tactile Sensors Using PVDF-TrFE Copolymer
Author
Li, Chunyan ; Wu, Pei-Ming ; Lee, Soohyun ; Gorton, Andrew ; Schulz, Mark J. ; Ahn, Chong H.
Author_Institution
Univ. of Cincinnati, Cincinnati
Volume
17
Issue
2
fYear
2008
fDate
4/1/2008 12:00:00 AM
Firstpage
334
Lastpage
341
Abstract
In this paper, a new mold-transfer method to pattern piezoelectric polymer has been developed and applied to fabricate innovative dome and bump shape polyvinylidene-fluoride-trifluoroethylene (PVDF-TrFE) films. The dome and bump shape PVDF-TrFE films have been successfully fabricated and characterized as a sensing component for flexible tactile sensors. The tactile sensors developed using these polymer microstructures show a high sensitivity which can measure as small as 40 mN force for bump shape sensors and 25 mN for dome shape sensors. The newly developed fabrication method provides a flexible way to pattern the piezoelectric polymer with different shapes and dimensions, including bump and dome shape piezoelectric polymer microstructures. In addition, a selective dc poling method for the PVDF-TrFE film has been developed for fabricating precisely located piezoelectric sensors with minimum crosstalk. The bump and dome shape PVDF-TrFE films developed in this paper can have numerous applications for microcatheters or other minimally invasive biomedical devices.
Keywords
microsensors; piezoelectric devices; piezoelectric materials; polymer blends; tactile sensors; transfer moulding; PVDF-TrFE copolymer; bump shape piezoelectric tactile sensors; flexible dome tactile sensor; mold-transfer method; piezoelectric polymer; polyvinylidene-fluoride-trifluoroethylene films; precisely located piezoelectric sensors; selective dc poling method; Bump shape; dome shape; flexible tactile sensor; mold-transfer method; piezoelectric devices; polyvinylidene-fluoride-trifluoroethylene (PVDF-TrFE) piezoelectric copolymer;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2007.911375
Filename
4446607
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