DocumentCode
106213
Title
Clarification of Stress Field Measured by Multiwavelength Micro-Raman Spectroscopy in the Surrounding Silicon of Copper-Filled Through-Silicon Vias
Author
Yuen Sing Chan ; Xiaowu Zhang
Author_Institution
Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore
Volume
4
Issue
6
fYear
2014
fDate
Jun-14
Firstpage
1010
Lastpage
1014
Abstract
Recently, micro-Raman spectroscopy has become popular in the near-surface silicon stress measurement around copper-filled through-silicon vias. Because the stress σRaman measured by the micro-Raman spectroscopy is a combined result of all of the stress components, interpretation of this stress becomes obscure. Ryu et al. has claimed that σRaman is approximately biaxial and hence it is proportional to σr + σθ. On the other hand, Wilson et al. has claimed that σr + σθ should be close to zero and hence σRaman is directly proportional to σz. In view of the dilemma as proposed by different research groups, this paper aims to provide insight into the origin of this stress so that it can be understood and used properly.
Keywords
Raman spectroscopy; copper; finite element analysis; stress measurement; three-dimensional integrated circuits; Cu; Si; copper-filled through-silicon vias; finite element analysis; multiwavelength microRaman spectroscopy; near-surface silicon stress measurement; Copper; Packaging; Silicon; Spectroscopy; Stress; Stress measurement; Through-silicon vias; Copper-filled through-silicon vias (TSVs); finite element analysis (FEA); micro-Raman spectroscopy; stress measurement; stress measurement.;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2014.2319110
Filename
6810191
Link To Document