DocumentCode
1064557
Title
Quasi-Resonant Interconnects: A Low Power, Low Latency Design Methodology
Author
Rosenfeld, Jonathan ; Friedman, Eby G.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY
Volume
17
Issue
2
fYear
2009
Firstpage
181
Lastpage
193
Abstract
Design and analysis guidelines for quasi-resonant interconnect networks (QRN) are presented in this paper. The methodology focuses on developing an accurate analytic distributed model of the on-chip interconnect and inductor to obtain both low power and low latency. Excellent agreement is shown between the proposed model and SpectraS simulations. The analysis and design of the inductor, insertion point, and driver resistance for minimum power-delay product is described. A case study demonstrates the design of a quasi-resonant interconnect, transmitting a 5 Gb/s data signal along a 5 mm line in a TSMC 0.18-mum CMOS technology. As compared to classical repeater insertion, an average reduction of 91.1% and 37.8% is obtained in power consumption and delay, respectively. As compared to optical links, a reduction of 97.1% and 35.6% is observed in power consumption and delay, respectively.
Keywords
CMOS integrated circuits; capacitance; inductors; integrated circuit design; integrated circuit interconnections; power consumption; CMOS technology; integrated circuits; interconnect capacitance; low latency on-chip interconnect design methodology; on-chip inductors; power consumption; power delay; power dissipation; quasiresonant interconnect networks; size 0.18 mum; CMOS technology; Delay; Design methodology; Energy consumption; Guidelines; Inductors; Optical fiber communication; Repeaters; Semiconductor device modeling; Signal design; Latency; on-chip inductors; on-chip interconnects; power dissipation; resonance;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2008.2011197
Filename
4749252
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