• DocumentCode
    1064557
  • Title

    Quasi-Resonant Interconnects: A Low Power, Low Latency Design Methodology

  • Author

    Rosenfeld, Jonathan ; Friedman, Eby G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY
  • Volume
    17
  • Issue
    2
  • fYear
    2009
  • Firstpage
    181
  • Lastpage
    193
  • Abstract
    Design and analysis guidelines for quasi-resonant interconnect networks (QRN) are presented in this paper. The methodology focuses on developing an accurate analytic distributed model of the on-chip interconnect and inductor to obtain both low power and low latency. Excellent agreement is shown between the proposed model and SpectraS simulations. The analysis and design of the inductor, insertion point, and driver resistance for minimum power-delay product is described. A case study demonstrates the design of a quasi-resonant interconnect, transmitting a 5 Gb/s data signal along a 5 mm line in a TSMC 0.18-mum CMOS technology. As compared to classical repeater insertion, an average reduction of 91.1% and 37.8% is obtained in power consumption and delay, respectively. As compared to optical links, a reduction of 97.1% and 35.6% is observed in power consumption and delay, respectively.
  • Keywords
    CMOS integrated circuits; capacitance; inductors; integrated circuit design; integrated circuit interconnections; power consumption; CMOS technology; integrated circuits; interconnect capacitance; low latency on-chip interconnect design methodology; on-chip inductors; power consumption; power delay; power dissipation; quasiresonant interconnect networks; size 0.18 mum; CMOS technology; Delay; Design methodology; Energy consumption; Guidelines; Inductors; Optical fiber communication; Repeaters; Semiconductor device modeling; Signal design; Latency; on-chip inductors; on-chip interconnects; power dissipation; resonance;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2008.2011197
  • Filename
    4749252