DocumentCode
1069473
Title
Vertical p-n-p for complementary bipolar technology
Author
Magdo, Ingrid E.
Author_Institution
IBM Corporation, East Fishkill, NY
Volume
27
Issue
8
fYear
1980
fDate
8/1/1980 12:00:00 AM
Firstpage
1394
Lastpage
1396
Abstract
A process to fabricate high-performance vertical p-n-p devices has been developed. The use of a high-dose boron-implanted poly-Si layer to form the emitter is essential to obtain shallow emitters with high emitter gradient. The devices exhibit very high current gain (>200) and a calculated cutoff frequency of 3.6 GHz. The process as developed is compatible with the n-p-n process and, thus, suitable for fabrication of complementary bipolar devices.
Keywords
Annealing; Boron; Circuits; Cutoff frequency; Data systems; Fabrication; Implants; Silicon; Stacking; Substrates;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1980.20046
Filename
1480839
Link To Document